BONDPLAS ENGINEERING (the "Company") is a Business, incorporated on November 13, 2003 (Thursday) in Singapore. The address of the Company's registered office is 20 WOODLANDS LINK #08-16 738733. The Company's current operating status is Live and has been operating for 21 years , 1 day. This Company's principal activity is engineering design and consultancy activities n.e.c.
No changes recorded for this company.