BONDPLAS ENGINEERING
ActiveBONDPLAS ENGINEERING is a business incorporated on November 13, 2003 in Singapore.
Singapore 738733
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Singapore Standard Industrial Classification (SSIC)
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ENGINEERING DESIGN AND CONSULTANCY ACTIVITIES N.E.C.
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About BONDPLAS ENGINEERING
BONDPLAS ENGINEERING is a business registered in Singapore with UEN 53008004D. The company was incorporated on November 13, 2003 and is currently live.
The primary business activity of BONDPLAS ENGINEERING is engineering design and consultancy activities n.e.c. (SSIC code: 71129).
The registered office address of BONDPLAS ENGINEERING is located at 20 WOODLANDS LINK #08-16 738733, Singapore 738733.
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